Hardware

Thermal Paste

A material placed between a processor and cooler to fill tiny surface gaps and help transfer heat. Replace it when the cooler is removed or when inspection shows a problem; service life varies.

How it works

Thermal paste is an interface material between a chip’s heat-spreading surface and a cooler. It fills microscopic gaps; it does not replace a correctly mounted heatsink. Suitable material, application and mounting pressure depend on the processor and cooling system.

A practical example

After cooler removal, old material may no longer provide the intended contact when the cooler is remounted. Follow the manufacturer’s preparation and application procedure rather than adding arbitrary layers. Some coolers already have material applied and should not receive an extra layer without guidance.

What to check

Identify the cooler, processor and recommended material. Inspect mounting, fan operation and airflow before blaming the paste for high temperatures. If servicing is appropriate, disconnect power and follow the exact cleaning and fitting instructions, then compare temperature under the same workload.

Limits and safe next steps

More paste is not automatically better. Some interface products are electrically conductive or unsuitable for particular surfaces. Do not substitute liquid metal casually or spread material onto contacts. If access requires unfamiliar disassembly, use a qualified repair procedure.

Technical sources

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